Descriptif

Type d’accord : échange non diplômant in Microelectronics Science and Engineering

Durée de la mobilité : 1 semestre – 2 semestres

Nombre d’ECTS locaux rapportés à l’étudiant Télécomien par semestre équivalant à 30 ECTS par semestre requis par TP pour validation de l’OMI (obligation de mobilité internationale).

1. Nomination by home university, send us by Email the Students’ List and theirs documents including

- Copy of passport
- CV
- Motivation Letter（signed）
- Transcripts
- Letter of recommendation (only for double degree students)

- Consent Letter of Outgoing Exchange from the nominee’s home university/Studying Certificate

2. We will confirm the host College in Tongji University, the Chinese tutor and the theme/major for the nominated students.

3. Nominated students fill out their information online: http://study-info.tongji.edu.cn/, and download and print out the “Application Form for International Exchange Students”. Then send the Application form to: chenyu@tongji.edu.cn

.

PS： For more information, please find on the website of the International Student Office of Tongji University: https://study.tongji.edu.cn/English/HOME.htm

Application Period

Spring semester: September 10^th - November 30^th

Fall semester: March 10^th - May 31^st

^{1) For course and professors information： Electronic and Information Engineering College}

^{E-mail Address: 22041@tongji.edu.cn Tel: 86-021-69587684 Address: 4800 Caoan Rd, Zhixing Building, Room 740,Jiading District, Shanghai, China, Postal Code 201804 2)}

^{For application information： Tongji University International Student Office (Application Materials Mailing Address)
E-mail Address：iso-zhaosheng@tongji.edu.cn ) Tel: 86-21-65983611 Address: No. 1239 Siping Road, Zhonghe Building Room 705, Shanghai , China, Postal Code 200092}